Single-Wafer Wet Brush Scrubbing Equipment

ItemSpecification
Application FieldWafer-level wafer manufacturing (silicon, silicon carbide) and advanced packaging fields
Wafer Specifications

150mm~300mm

2~4 load ports

Wafer size

Wafer flip function for sequential backside and frontside cleaning

Equipped with backside brush scrub and edge brush scrub

Megasonic cleaning process and two-fluid cleaning

Supports SECS/GEM communication protocol

Process Standards

Particles <20ea@0.16um

PRE ≥97% @ 0.09um

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