Other Products
SEMCTCEH specializes in the integrated development, production and sales of wet process equipment.
Single-wafer Wet Etching Equipment
| Item | Specification |
| Applicable Wafer Size | 8-inch wafer |
| Number of Chambers | 2EA, 4EA, 8EA optional |
| Cassette | 2EA, 4EA Open Cassette or Load Port |
| ROBOT | Dual-arm transfer, prevents cross-contamination |
| Chuck | Mechanical clamping type / Vacuum adsorption type |
| Etching | Silicon, silicon oxide, copper, titanium, and other metal etching |
| Drying Method | Spin dry; N₂ spin dry |
| Particles | <10ea @0.3μm |
| Metal Ions | All Metal <2.5E10 atoms/cm² |
| Etching Uniformity | <5% |
| Equipment Utilization Rate | >98% |
| Equipment Appearance | 9002 White PVC |
| Equipment Dimensions | 2100mm(L) × 2100mm(W) × 2300mm(H) |
| Communication Protocol | Supports SECS/GEM & MES |
