Fully Automatic Etching Cleaning Machine
SEMCTCEH specializes in the integrated development, production and sales of wet process equipment.
| Item | Specification |
| Applicable Workpiece | 6~12 inch wafer cleaning |
| Batch Capacity | 25 pcs/batch |
| Process Flow | LOAD → SC1 → QDR → SC2 → QDR → DHF → QDR → DRYING → UNLOAD |
| Main Materials | Metal frame + PVC/PPW shell plate, tank made of Quartz/PPN/PTFE material |
| Transfer Method | Robot arm transfer |
| Cycle Time | Adjustable from 5~10 minutes according to process requirements |
| Process Performance | Particle removal rate >99% |
| Other Description | This equipment can be customized to manual/semi-automatic operation according to customer requirements |
Applications:Integrated Circuits
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Applications:Integrated Circuits
Categories: Other Products
Applications:Compound Semiconductors
Categories: Other Products
Applications:Integrated Circuits
Categories: Other Products