Fully Automatic RCA Cleaning System

ItemSpecification
Applicable Workpiece6~12 inch wafer cleaning
Batch Capacity25/50 pcs/batch
Process FlowLOAD → SPM → QDR → DHF → QDR → SC1 → QDR → SC2 → QDR → DRYING → UNLOAD
Main MaterialsMetal frame + PVC/PPW shell plate, tank made of Quartz/PPN/PTFE material
Transfer MethodRobot arm transfer
Cycle TimeAdjustable from 5~10 minutes according to process requirements
Process PerformanceParticle removal rate >99%
Other DescriptionThis equipment can be customized to manual/semi-automatic operation according to customer requirements

Related Products